The ultraviolet laser marking machine belongs to the series of laser marking machines, but it is developed using a 355nm ultraviolet laser. Compared with infrared laser, this machine adopts third-order intracavity frequency doubling technology. The 355 ultraviolet focused spot is extremely small, which can greatly reduce the mechanical deformation of materials and have a small impact on processing heat. It is mainly used for ultra-fine marking and engraving, especially suitable for marking food and pharmaceutical packaging materials, micro hole drilling, high-speed division of glass materials, and complex graphic cutting of silicon wafers.

Features:

1. Good beam quality, small focused spot, capable of achieving ultra-fine marking;

2. In addition to copper material, there is a wider range of materials suitable for processing, which compensates for the lack of infrared laser processing capability;

3. The heat affected area is extremely small, avoiding damage to the processed material and resulting in a high yield rate;

4. Fast marking speed, high efficiency, and high precision;

5. The whole machine has stable performance, small size, low power consumption, and can operate for a long time;

6. No consumables required, low usage and maintenance costs;

7. High electro-optical conversion rate, long service life of nonlinear crystals, modular design for easy installation and maintenance;

8. Two dimensional automatic workbench can be optionally selected to achieve continuous marking at multiple workstations or large format marking.

Application fields:

Applied to various types of glass TFT、 Marking and surface treatment of materials such as LCD screens, plasma screens, textiles, thin ceramic sheets, monocrystalline silicon wafers, IC grains, sapphire, polymer films, etc.